US Patent No: 4,903,437

Number of patents in Portfolio can not be more than 2000

Slicing machine for cutting semiconductor material

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Abstract

Slicing machine having a handle to be driven manually to generate command pulses. By revolving the handle, a feedtable is moved at the operator's command, enabling the positioning of a semiconductor material at the right position to start slicing. The thickness of the first wafer cut off from the material as well as other wafers, has a predetermined thickness, so that no wafer is wasted.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
MITSUBISHI MATERIALS CORPORATIONTOKYO976

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akiyama, Kazunari Machida, JP 4 99
Kubotera, Yutaka Yokohama, JP 2 77

Cited Art

Patent Info (Count) # Cites Year
 
TOYODA KOKI KABUSHIKI KAISHA (2)
4,294,045 Grinding machine with a sizing device 13 1980
4,368,596 Feed safety apparatus for movable member 7 1981
 
Fortuna-Werke Maschinenfabrik GmbH (1)
4,324,073 Process for automatic feed of steady jaws 6 1979

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
MICRON TECHNOLOGY, INC. (16)
6,250,192 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 12 1996
6,155,247 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 13 1999
6,196,096 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 8 1999
6,401,580 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 12 2000
6,255,196 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 4 2000
6,279,563 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 0 2000
6,427,676 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 12 2001
6,631,662 Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions 2 2001
6,459,105 Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions 3 2001
6,423,616 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 0 2001
6,691,696 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 5 2001
6,578,458 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 9 2002
6,687,990 Sawing method employing multiple indexing techniques and semiconductor device structures fabricated thereby 6 2002
6,897,571 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 0 2002
6,932,077 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions and dicing apparatus 2 2003
7,387,119 Dicing saw with variable indexing capability 0 2005
 
NEPTUNE TECHNOLOGY GROUP INC. (1)
7,424,377 Power reduction method in an electronic counter 0 2003
 
NISSIN MANUFACTURING CO., LTD. (1)
8,162,722 Grindstone contact sensing method and its device, and honing method and honing machine 0 2009
 
TEXAS INSTRUMENTS INCORPORATED (1)
6,718,227 System and method for determining a position error in a wafer handling device 4 2000
 
Other [Check patent profile for assignment information] (1)
6,493,934 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 0 2001