Method of and apparatus for treating waste gas from semiconductor manufacturing process
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United States of America Patent
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Mar 6, 1990
Grant Date -
N/A
app pub date -
Sep 23, 1988
filing date -
Sep 25, 1987
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of and apparatus for treating waste gas from semiconductor manufacturing equipment with a dry solid absorbent. A bypass pipe which is equipped with a bypass valve is provided between inlet and outlet pipes of a container packed with the absorbent, and when a reaction chamber of the semiconductor manufacturing equipment is evacuated to a level below that of atmospheric pressure, the bypass valve is opened to prevent the large amount of non-toxic gas that is discharged from the reaction chamber during the evacuation from being fed to the absorbent-packed container. Large variations in the flow rate of the gas are thus avoided and safe and efficient waste gas treatment with a dry solid absorbent having a relatively small particle diameter is possible.
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