Semiconductor arrangement having at least one semiconductor body
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United States of America Patent
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Mar 6, 1990
Grant Date -
N/A
app pub date -
Dec 24, 1987
filing date -
Jan 21, 1987
priority date (Note) -
Expired
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Abstract
In a semiconductor arrangement having at least one semiconductor body located on an insulating substrate provided with interconnects, a low-inductance arrangement can be achieved in that the connecting leads are arranged in close proximity to one another and at least partially parallel to one another.
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