Method of bonding gold or gold alloy wire to lead tin solder
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United States of America Patent
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-
Mar 13, 1990
Grant Date -
N/A
app pub date -
Oct 28, 1988
filing date -
Oct 28, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A compression bond is formed between a gold or gold alloy wire and lead/tin solder by forming a head on the wire and forcing the head into a pad of the solder by thermosonic, or thermocompression, or ultrasonic compression bonding techniques. This forms a gold/tin intermetallic compound which in turn forms the bond. The head of the wire is maintained out of contact with any underlying surface, and surrounded by the solder.
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