Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
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United States of America Patent
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Mar 13, 1990
Issued Date -
N/A
app pub date -
Apr 29, 1988
filing date -
Oct 31, 1986
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Electroless metal plating solutions are formulated and controlled to provide high quality metal deposits by establishing the intrinsic cathodic reaction rate of the solution less than 110% of the intrinsic anodic reaction rate. Methods are provided to formulate electroless copper plating solutions which can deposit copper on printed wiring boards of quality sufficient to pass a thermal stress of 10 seconds contact with molten solder at 288.degree. C. without cracking the copper deposits on the surface of the printed wiring boards or in the holes. The ratio of the anodic reaction rate to the cathodic reaction rate can be determined by electrochemical measurements, or it can be estimated by varying the concentration of the reactants and measuring the plating rates.
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