Multi-layer, heat-curable adhesive film
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United States of America Patent
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-
Mar 13, 1990
Grant Date -
N/A
app pub date -
Mar 14, 1988
filing date -
Mar 24, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Multi-layer, heat-curable adhesive film having a tacky external curable layer A and a dry external curable layer B, containing various adducts which contain epoxide groups and are formed from an aromatic diglycidyl or polyglycidyl ether together with a carboxyl-terminated butadiene/acrylonitrile rubber and adducts of this type with a carboxyl-terminated polyester, and also aromatic diglycidyl or polyglycidyl ethers, varying amounts of fillers, dicyandiamide as a curing agent, a curing accelerator and, if appropriate, a carrier material between the layers A and B, is suitable for bonding various substrates and is preferably employed for bonding metal structural components without prior cleaning of these components.
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