Compact encapsulated filter assembly for printed circuit boards and method of manufacture thereof
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United States of America Patent
Stats
-
Mar 13, 1990
Grant Date -
N/A
app pub date -
Sep 30, 1987
filing date -
Sep 30, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An improved filter assembly (10) for filtering RFI/EMI in printed circuit boards is disclosed, together with methods of manufacture thereof. A filter sleeve (16) is carried by an outer leg (11) of the filter assembly and is substantially parallel to the respective legs (11, 12, 13) thereof, thereby providing a compact structure for improved circuit miniaturization. The filter assemblies are encapsulated with a suitable insulating material (17). The respective filter assemblies (10) are made in a continuous strip, suitably stamped, and broken off as desired by the user. In a further embodiment, the respective filter assemblies are made from a continuous wire, suitably bent and formed, and cut off as desired.
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