Furnace to solder integrated circuit chips
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United States of America Patent
Stats
-
Mar 20, 1990
Grant Date -
N/A
app pub date -
Jul 22, 1988
filing date -
Jul 24, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A furnace for soldering integrated circuit chips on a ceramic substrate has a heating plate supporting the substrate, the plate comprising perforations at the places where the integrated circuit chips will be soldered, behind the plate, a heat radiation source and a device to direct the radiation as desired towards only one of the apertures of the plate at a time.
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