Method and photosensitive material for forming metal patterns employing microcapsules
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United States of America Patent
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Mar 20, 1990
Issued Date -
N/A
app pub date -
Oct 28, 1988
filing date -
Mar 30, 1987
priority date (Note) -
Expired
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Abstract
Processes for forming metal patterns such as electric circuits and photosensitive materials useful therein are disclosed wherein a layer of photosensitive microcapsules is used to form a pattern of an adhesive, a metallic pigment, a metal salt or a reducing agent by exposing the layer of microcapsules to actinic radiation and transferring the internal phase to a support member. A pattern of the pigment salt or reducing agent is thereby formed on the support member which is treated with an electroless plating solution to form the metal pattern.
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