Composition containing epoxy resin, di(meth)acrylate, N-heterocylic compound and polyamine
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United States of America Patent
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Mar 20, 1990
Grant Date -
N/A
app pub date -
Sep 12, 1988
filing date -
Sep 11, 1987
priority date (Note) -
Expired
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Abstract
Disclosed is a curable epoxy resin composition having excellent flexibility and toughness, comprising (a) an epoxy resin, (b) a glycol type di(meth)acrylate, (c) a nitrogen containing heterocyclic compound, and (d) a polyamine having at least two amino groups with an active hydrogen. The resin composition is very suitable for a vibration damping laminate.
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