Multiple lead probe for integrated circuits in wafer form

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 4912399
SERIAL NO

07059903

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A probe assembly for use in conveying signals between cables from test apparatus and contact areas on a contact face of an integrated circuit includes a support member having an aperture therein and a dielectric membrane clamped over the aperture such that conductive bumps mounted on the underside of the periphery of the membrane engage corresponding contact areas on an upper surface of the support member surrounding the aperture. A central area of the membrane extends downward through the aperture such that conductive bumps on the under side of the central area of the membrane engage contact areas on the contact face of an integrated circuit situated below the aperture. A plurality of conductor runs supported by the membrane extend from the conductive bumps in the central area of the membrane to the conductive bumps in the periphery of the membrane. A plurality of second conductor runs supported by the support member extend from the contact areas surrounding the aperture to test apparatus cable connectors adjacent to the periphery of the support member.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
TEKTRONIX INC A CORP OF ORP BOX 500 BEAVERTON OR 97077

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Garuts, Valdis E Beaverton, OR 12 275
Greub, Hans J Troy, NY 6 257

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation