Electronic package with heat spreader member

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 4914551
SERIAL NO

07218725

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An electronic package (10) including a first circuitized substrate 11 (e.g., printed circuit board) having connected thereto a second, flexible circuitized substrate (e.g., polyimide with chrome-copper-chrome circuitry thereon). The second substrate is in turn electrically connected to the invention's semiconductor device (e.g., silicon chip), which device in turn is attached to a heat spreader (37) for providing effective heat transference from the device to the package's heat sink (33). The heat sink is attached to the first substrate (e.g., using solder). Significantly, the coefficients of thermal expansion of the heat spreader, semiconductor device and adhesive used to connect same are substantially similar, around 2 to 5 ppm/degree Kelvin (.times.10.sup.-6 m/m degrees Kelvin), in order to provide an effective heat path from the heat-generating device to the corresponding, much larger heat sink.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
INTERNATIONAL BUSINESS MACHINES CORPORATIONARMONK, NY46918

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Anschel, Morris Binghamton, NY 8 260
Sammakia, Bahgat G Johnson City, NY 10 568

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
* 4415025 Thermal conduction element for semiconductor devices 86 1981
 
NEC CORPORATION (1)
* 4612601 Heat dissipative integrated circuit chip package 56 1984
 
SMITHS INDUSTRIES PUBLIC LIMITED COMPANY (1)
* 4509096 Chip-carrier substrates 108 1984
 
TELEDYNE INDUSTRIES, INC. (1)
* 4700273 Circuit assembly with semiconductor expansion matched thermal path 29 1986
 
TEXAS INSTRUMENTS INCORPORATED (1)
* 4750089 Circuit board with a chip carrier and mounting structure connected to the chip carrier 58 1985
 
RCA Licensing Corporation (1)
* 4593342 Heat sink assembly for protecting pins of electronic devices 23 1984
 
HITACHI, LTD. (1)
* 4764804 Semiconductor device and process for producing the same 141 1987
 
HONEYWELL INC. (1)
* 4256792 Composite electronic substrate of alumina uniformly needled through with aluminum nitride 26 1980
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (3)
* 2004/0169,998 Coated heat spreaders 0 2004
* 2005/0214,523 Phase change material containing fusible particles as thermally conductive filler 0 2005
* 2007/0223,159 Semiconductor Module with Serial Bus Connection to Multiple Dies 3 2007
 
BULL S.A. (1)
* 5901039 Mounting device for electronic components 59 1997
 
SONY CORPORATION (1)
* 6392309 Semiconductor device including solid state imaging device 46 1996
 
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (5)
7138300 Structural design for flip-chip assembly 1 2004
* 2006/0063,300 Structural design for flip-chip assembly 0 2004
8970029 Thermally enhanced heat spreader for flip chip packaging 2 2010
* 2011/0024,892 THERMALLY ENHANCED HEAT SPREADER FOR FLIP CHIP PACKAGING 1 2010
9721868 Three dimensional integrated circuit (3DIC) having a thermally enhanced heat spreader embedded in a substrate 0 2015
 
DOWA METALTECH CO., LTD. (2)
* 7256353 Metal/ceramic bonding substrate and method for producing same 9 2003
* 2004/0144,561 Metal/ceramic bonding substrate and method for producing same 4 2003
 
MULTEK FLEXIBLE CIRCUITS, INC. (2)
* 5798171 Adherent film with low thermal impedance and high electrical impedance used in an electronic assembly with a heat sink 20 1996
* 5766740 Adherent film with low thermal impedance and high electrical impedance used in an electronic assembly with a heat sink 28 1996
 
SAMSUNG ELECTRONICS CO., LTD. (1)
* 5473510 Land grid array package/circuit board assemblies and methods for constructing the same 120 1994
 
HITACHI, LTD. (2)
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* 6380621 Semiconductor device and manufacturing method thereof 21 2000
 
ORACLE AMERICA, INC. (3)
6727193 Apparatus and methods for enhancing thermal performance of integrated circuit packages 1 2002
* 6637506 Multi-material heat spreader 7 2002
* 2003/0171,006 Apparatus and methods for enhancing thermal performance of integrated circuit packages 0 2002
 
THE WHITAKER CORPORATION (2)
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* 5514917 Heat dissipating housing for current 2 1994
 
NANO MATERIALS INTERNATIONAL CORPORATION (6)
* 7279023 High thermal conductivity metal matrix composites 3 2003
* 2005/0074,355 High thermal conductivity metal matrix composites 2 2003
8066937 Method for making high thermal conductivity metal matrix composite 1 2007
7988758 High thermal conductivity metal matrix composites 0 2010
* 2010/0110,637 HIGH THERMAL CONDUCTIVITY METAL MATRIX COMPOSITES 2 2010
8673453 High thermal conductivity metal matrix composites 0 2011
 
APPLE COMPUTER, INC. (1)
* 5504652 Unitary heat sink for integrated circuits 39 1994
 
KABUSHIKI KAISHA TOSHIBA (2)
* 5025347 Semiconductor device 11 1989
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INTERNATIONAL BUSINESS MACHINES CORPORATION (19)
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* 5057969 Thin film electronic device 32 1990
* 5099393 Electronic package for high density applications 136 1991
* 5059129 Connector assembly including bilayered elastomeric member 43 1991
* 5161087 Pivotal heat sink assembly 45 1991
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* 5198965 Free form packaging of specific functions within a computer system 90 1991
* 5847929 Attaching heat sinks directly to flip chips and ceramic chip carriers 85 1996
* 6037658 Electronic package with heat transfer means 35 1997
* 6060341 Method of making an electronic package 3 1998
* 6069023 Attaching heat sinks directly to flip chips and ceramic chip carriers 63 1998
* 6275381 Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof 27 1998
6251707 Attaching heat sinks directly to flip chips and ceramic chip carriers 31 2000
* 6292367 Thermally efficient semiconductor chip 17 2000
6424533 Thermoelectric-enhanced heat spreader for heat generating component of an electronic device 50 2000
6444496 Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof 62 2000
* 7544527 Method and apparatus for providing optoelectronic communication with an electronic device 3 2006
* 2006/0182,397 METHOD AND APPARATUS FOR PROVIDING OPTOELECTRONIC COMMUNICATION WITH AN ELECTRIC DEVICE 2 2006
 
HEWLETT-PACKARD COMPANY (3)
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* 5065280 Flex interconnect module 39 1990
* 5142444 Demountable tape-automated bonding system 7 1991
 
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (3)
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* 5396403 Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate 155 1993
 
LSI LOGIC CORPORATION (1)
* 5923538 Support member for mounting a microelectronic circuit package 10 1996
 
KABUSHIKI KAISHA KOBE SEIKO SHO (KOBE STEEL, LTD.) (2)
* 7067903 Heat spreader and semiconductor device and package using the same 59 2003
* 2004/0238,946 Heat spreader and semiconductor device and package using the same 18 2003
 
Philip Morris USA Inc. (1)
* 2007/0287,005 Phase change material containing fusible particles as thermally conductive filler 4 2007
 
INTERNATIONAL RECTIFIER CORPORATION (2)
* 6784540 Semiconductor device package with improved cooling 13 2002
* RE41559 Semiconductor device package with improved cooling 3 2006
 
AAVID THERMALLOY, LLC (1)
* 6097603 Heat sink for direct attachment to surface mount electronic device packages 12 1997
 
GLOBALFOUNDRIES INC. (5)
* 5744863 Chip carrier modules with heat sinks attached by flexible-epoxy 135 1995
* 5672548 Method for attaching heat sinks directly to chip carrier modules using flexible-epoxy 119 1996
* 5785799 Apparatus for attaching heat sinks directly to chip carrier modules using flexible epoxy 39 1997
* 5900675 Organic controlled collapse chip connector (C4) ball grid array (BGA) chip carrier with dual thermal expansion rates 53 1997
6529379 Article exhibiting enhanced adhesion between a dielectric substrate and heat spreader and method 8 1998
 
SILICONWARE PRECISION INDUSTRIES CO., LTD. (1)
* 6236568 Heat-dissipating structure for integrated circuit package 45 1999
 
SUMITOMO ELECTRIC INDUSTRIES, LTD. (1)
* 5132776 Member for carrying a semiconductor device 9 1991
 
Aavid Engineering, Inc. (1)
* 5285350 Heat sink plate for multiple semi-conductors 62 1992
 
RAMBUS INC. (3)
* RE42318 Semiconductor module with serial bus connection to multiple dies 1 2006
RE42785 Semiconductor module with serial bus connection to multiple dies 0 2010
RE42429 Semiconductor module with serial bus connection to multiple dies 1 2010
 
FUJITSU LIMITED (1)
* 2007/0012,477 Electronic component package including joint material having higher heat conductivity 7 2005
 
SUN MICROSYSTEMS, INC. (1)
* 6081028 Thermal management enhancements for cavity packages 8 1995
 
MOTOROLA, INC. (1)
* 5041699 Laminated thermally conductive substrate 3 1990
 
INFINEON TECHNOLOGIES AG (2)
* 8089768 Component arragement with an optimized assembly capability 2 2005
* 2009/0213,552 Component arragement with an optimized assembly capability 5 2005
 
Magnecomp Corporation (3)
6995954 ESD protected suspension interconnect 17 2002
7489493 Method to form electrostatic discharge protection on flexible circuits using a diamond-like carbon material 2 2004
* 2005/0117,257 Method to form electrostatic discharge protection on flexible circuits 36 2004
 
INTEL CORPORATION (8)
* 7036573 Polymer with solder pre-coated fillers for thermal interface materials 8 2002
6926955 Phase change material containing fusible particles as thermally conductive filler 13 2002
* 2003/0153,667 Phase change material containing fusible particles as thermally conductive filler 6 2002
* 7132313 Diamond heat spreading and cooling technique for integrated circuits 39 2003
* 2004/0104,014 Diamond heat spreading and cooling technique for integrated circuits 1 2003
* 7219421 Method of a coating heat spreader 5 2004
7294394 Phase change material containing fusible particles as thermally conductive filler 2 2005
7960019 Phase change material containing fusible particles as thermally conductive filler 3 2007
 
PARKER INTANGIBLES LLC (1)
* 6705388 Non-electrically conductive thermal dissipator for electronic components 16 1998
 
HTC CORPORATION (1)
* 6188578 Integrated circuit package with multiple heat dissipation paths 51 1999
 
STMICROELECTRONICS S.R.L. (1)
* 6195256 Card assembly of power device in plastic package with external heat sink soldered to the internal heat sink 8 1998
 
The United States of America as represented by the Secretary of the Navy (1)
* 5391914 Diamond multilayer multichip module substrate 43 1994
 
NVIDIA CORPORATION (2)
* 7254033 Method and apparatus for heat dissipation 4 2004
* 2008/0266,786 METHOD AND APPARATUS FOR HEAT DISSIPATION 0 2007
 
EXPORT-CONTOR AUSSENHANDELSGESELLSCHAFT MBH (1)
* 5296739 Circuit arrangement with a cooling member 39 1992
 
NORTEL NETWORKS LIMITED (1)
* 5646826 Printed circuit board and heat sink arrangement 60 1996
 
SEIKO EPSON CORPORATION (14)
* 6025993 Cartridge for electronic devices 21 1997
6404639 Cartridge for electronic devices 14 1999
6515864 Cartridge for electronic devices 11 2002
6608753 Cartridge for electronic devices 8 2002
6771509 Cartridge for electronic devices 7 2003
6845014 Cartridge for electronic devices 9 2003
7035108 Information processing device 9 2004
7359202 Printer apparatus 2 2005
7345883 Processing device 5 2007
* 2007/0177,357 PROCESSING DEVICE 2 2007
7583505 Processor apparatus 6 2008
* 2008/0158,829 PROCESSOR APPARATUS 2 2008
7804688 Apparatus including processor 24 2009
* 2009/0284,913 APPARATUS INCLUDING PROCESSOR 3 2009
 
P1 Diamond, Inc. (2)
6919525 Thermal management components 12 2001
* 2002/0141,155 Thermal management components 4 2001
 
Whelen Engineering Company, Inc. (1)
* 5016139 Electronic power supply with enhanced heat transfer characteristics 30 1989
 
MICRON TECHNOLOGY, INC. (1)
* 7082033 Removing heat from integrated circuit devices mounted on a support structure 2 1998
 
JUNIPER NETWORKS, INC. (1)
* 8952524 Re-workable heat sink attachment assembly 0 2006
 
Thomson-CSF (1)
* 6560121 Method for surface mounting of a microwave package on a printed circuit and package and printed circuit for implementing said method 1 2000
 
GraTech International Holdings, Inc. (1)
7658999 Heat spreader for emissive display device 8 2006
 
NEOGRAF SOLUTIONS, LLC (21)
7160619 Heat spreader for emissive display device 22 2004
* 2005/0079,304 Heat spreader for emissive display device 2 2004
7276273 Heat spreader for display device 17 2004
* 2005/0142,317 Heat spreader for display device 1 2004
7303820 Heat spreader for display device 22 2005
* 2006/0098,413 Heat spreader for display device 2 2005
7306847 Heat spreader for display device 24 2005
* 2006/0171,124 Heat spreader for display device 4 2005
9081220 Optimized frame system for a display device 1 2005
* 2008/0151,502 DISPLAY DEVICE 8 2005
7385819 Display device 13 2005
* 2006/0290,875 Optimized frame system for a display device 4 2005
9104058 Optimized frame system for a liquid crystal display device 2 2005
9087669 Display device having improved properties 1 2005
* 2006/0292,461 Optimized frame system for a liquid crystal display device 8 2005
8211260 Heat spreader for plasma display panel 0 2006
* 2007/0042,188 Heat spreader for emissive display device 11 2006
9761403 Heat spreader for plasma display panel 0 2012
9250462 Optimized frame system for a liquid crystal display device 0 2015
9253932 Display device having improved properties 0 2015
9253924 Optimized frame system for a display device 0 2015
 
NEC CORPORATION (2)
* 5455457 Package for semiconductor elements having thermal dissipation means 69 1993
* 5777847 Multichip module having a cover wtih support pillar 39 1997
 
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. (2)
* 5909056 High performance heat spreader for flip chip packages 116 1997
* 6681482 Heatspreader for a flip chip device, and method for connecting the heatspreader 15 2000
 
GENERAL ELECTRIC COMPANY (1)
* 5777844 Electronic control with heat sink 38 1996
 
3M INNOVATIVE PROPERTIES COMPANY (6)
* 6071597 Flexible circuits and carriers and process for manufacture 65 1997
6316734 Flexible circuits with static discharge protection and process for manufacture 73 2000
6459043 Flexible circuit with electrostatic damage limiting feature and method of manufacture 20 2001
6815620 Flexible circuit with electrostatic damage limiting feature 2 2002
* 2003/0062,194 Flexible circuit with electrostatic damage limiting feature 5 2002
7135203 Flexible circuit with electrostatic damage limiting feature 3 2004
 
CIENA CORPORATION (3)
* 5467251 Printed circuit boards and heat sink structures 86 1993
* 5661902 Methods of making printed circuit boards and heat sink structures 40 1995
* 6392890 Method and device for heat dissipation in an electronics system 26 2000
 
EASTMAN KODAK COMPANY (1)
* 5043845 High-speed CCD sensor mounting system with improved signal to noise operation and thermal contact 18 1989
 
LAIRD TECHNOLOGIES, INC. (1)
9258928 Assemblies and methods for dissipating heat from handheld electronic devices 0 2013
 
FUJIKURA LTD. (1)
* 2004/0165,354 Heat radiating structure for electronic device 2 2004
 
Sundstrand Corporation (1)
* 5214564 Capacitor assembly with integral cooling apparatus 54 1992
 
DELTA ELECTRONICS, INC. (1)
* 6724631 Power converter package with enhanced thermal management 14 2002
* Cited By Examiner