Electronic package with heat spreader member

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 4914551
SERIAL NO

07218725

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An electronic package (10) including a first circuitized substrate 11 (e.g., printed circuit board) having connected thereto a second, flexible circuitized substrate (e.g., polyimide with chrome-copper-chrome circuitry thereon). The second substrate is in turn electrically connected to the invention's semiconductor device (e.g., silicon chip), which device in turn is attached to a heat spreader (37) for providing effective heat transference from the device to the package's heat sink (33). The heat sink is attached to the first substrate (e.g., using solder). Significantly, the coefficients of thermal expansion of the heat spreader, semiconductor device and adhesive used to connect same are substantially similar, around 2 to 5 ppm/degree Kelvin (.times.10.sup.-6 m/m degrees Kelvin), in order to provide an effective heat path from the heat-generating device to the corresponding, much larger heat sink.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
INTERNATIONAL BUSINESS MACHINES CORPORATIONARMONK, NY46802

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Anschel, Morris Binghamton, NY 8 261
Sammakia, Bahgat G Johnson City, NY 10 571

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