Method and device for forming a layer by plasma-chemical process

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United States of America Patent

PATENT NO 4915978
SERIAL NO

07281874

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Abstract

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A method and a device are proposed for formation of a layer on a surface of a substrate by plasma-chemical process, where the surface is aligned parallel to the electrical field required for the plasma-chemical process. In addition, the gas required therefor flows directly onto the surface.

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Patent Owner(s)

Patent OwnerAddress
NUKEM GMBHD-63434 HANAU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Liedtke, Dietmar Nidderau, DE 1 7
Schum, Berthold Biebergemund, DE 13 87
von, Campe Hilmar Bad Homburg, DE 20 198
WoJorg, Grobkrotzenburg, DE 1 7

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