Microcasting of microminiature tips
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United States of America Patent
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-
Apr 10, 1990
Grant Date -
N/A
app pub date -
Jan 13, 1989
filing date -
Jan 13, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A microminiature tip and tip assembly is fabricated using microelectronic fabrication techniques. A masking aperture is formed in a dielectric layer which overlies a (100) silicon substrate. For a square aperture, a pyramidal pit is anisotropically etched into the surface of the silicon substrate. Tungsten is selectively deposited in the pit to form a pyramid-shaped microminiature point. Continued deposition of tungsten fills the aperture to form a base portion of the tip which integrally locks the tip to the dielectric layer, which is fabricated to form a support member for the tip.
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