Semiconductor contact arrangement
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Apr 10, 1990
Grant Date -
N/A
app pub date -
Nov 16, 1988
filing date -
Dec 10, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor contact arrangement comprising a semiconductor wafer having on one of its major faces an area of one type of conductivity and an electrical contact in face-to-face engagement with that area, in which the contact is located with respect to that area and is secured to the sandwich by a stud welded to the wafer and projecting into a hole extending through the contact from the face thereof engaged with the wafer.
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