Method for the attachment of components to a circuit board using photoactuatable adhesive
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United States of America Patent
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-
Apr 17, 1990
Grant Date -
N/A
app pub date -
Mar 1, 1989
filing date -
Mar 2, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
For the attachment of components using the SMT method a procedure is suggested in which the adhesive used is activated prior to fitting of the components to the circuit board by irradiation with light having a wavelength in the range of 200 to 600 nm to such an extent that the desired initial tackiness is maintained and there is no formation of skin on the surface of the adhesive. This makes it possible to cause the adhesive composition to fully cure in a shorter time and at lower temperature than has been possible so far without the wettability of the adhesive during the fitting of the components to the circuit board being impaired.
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