Method and apparatus for inspecting integrated circuit probe cards
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United States of America Patent
Stats
-
Apr 17, 1990
Grant Date -
N/A
app pub date -
Oct 5, 1988
filing date -
Oct 5, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method and apparatus for inspecting integrated circuit probe cards in which the probe points of the probe card are scanned across a checkplate having a conductivity transition border. The impedances between the probe points and the checkplate as they cross the conductivity transition border are measured to determine when the probe points cross the border. The positions of the probe card when each of the probe points crosses the border are measured to determine the positions of the probe points relative to each other. In one embodiment, the checkplate is formed by a square conductive plate having three quadrants of insulated material and a single quadrant of conductive material mounted on its upper surface. These conductive strips connected to the conductive plate are positioned between the quadrants of insulative material to form the conductivity transition border. In other embodiments, multiple parallel strips or a single dot of conductive material are surrounded by insulative material.
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