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United States of America Patent
Stats
-
Apr 17, 1990
Grant Date -
N/A
app pub date -
Dec 27, 1988
filing date -
Dec 27, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Method and apparatus for packaging electronic equipment comprise a housing and a 'midplane' that is removably secured to suitable flanges centrally located within the housing. Individual sub-modules (CPU, disk drive, I/O unit, power supply, etc.) have suitable electrical connectors which mate with corresponding connectors on the midplane. The sub-modules are inserted into the midplane from different sides of the housing. The exposed, outer surfaces of the sub-modules may either be finished in final form, or suitable bezels may be placed over the sides of the housing so that the sub-modules can be appropriately accessed for necessary replacement or repair.
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