Surface treatment method and apparatus thereof
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United States of America Patent
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-
Apr 24, 1990
Issued Date -
N/A
app pub date -
Feb 28, 1989
filing date -
Oct 1, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Treatment baths for surface treatment of semiconductor wafers by dipping thereof into a treatment liquid are arranged in a treatment bath train. One or more selected treatment baths among these treatment baths are constructed to have a plurality of unit treatment vessels. The treatment liquid in these treatment vessels is replaced successively one by one of the unit treatment vessels. The semiconductor wafers are dipped in the treatment liquid contained in that unit treatment vessel that is not being subjected at that moment to the replacement of the treatment liquid.
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