Method for manufacturing a semiconductor device having a lens section
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United States of America Patent
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-
Apr 24, 1990
Issued Date -
N/A
app pub date -
Jan 7, 1987
filing date -
Jun 15, 1982
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for manufacturing a semiconductor device with a lens section. A semiconductor element is formed in a semiconductor substrate and a transparent layer is formed on this semiconductor element. The transparent layer is patterned to form the lens section.
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