Method of making a multilevel electrical airbridge interconnect
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United States of America Patent
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-
May 1, 1990
Grant Date -
N/A
app pub date -
Aug 4, 1989
filing date -
Aug 4, 1989
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of building a multilevel electrical interconnect supported by metal pillars with air as a dielectric. The metal conductors and metal support pillars are formed using a photo-imagible polymer which serves the function of patterning and also provides a temporary support during construction.
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