Microwavable thermal compress and method and use thereof
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United States of America Patent
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May 1, 1990
Issued Date -
N/A
app pub date -
May 31, 1988
filing date -
May 15, 1985
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A microwavable thermal pack and a method of heating the pack. The thermal pack is a completely sealed envelope constructed from opposed laminate layers, portions of which are joined by sealed seams. The layers define an inner chamber within which is disposed a heat transfer material. Each of the laminate layers includes a pair of co-extensive inner and outer films contacting each other throughout their surface areas. The films are selected so that the laminate layers of the thermal pack do not pass the heat transfer material during heating of the heat transfer material within the thermal pack which is equivalent to the energy developed by a microwave device operating at full power for a period of time greater than about one minute but less than about four minutes.
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