Apparatus for applying photo-resist to substrate
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United States of America Patent
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May 15, 1990
Issued Date -
N/A
app pub date -
Jan 9, 1989
filing date -
Dec 2, 1985
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Disclosed are improved method and apparatus by which the adhesion of a photo-resist applied onto a wafer substrate can be improved when using an adhesion reinforcing agent in combination. The method of applying a photo-resist according to the present invention comprises a steps of washing the substrate, a step of drying said substrate, a step of feeding an adhesion reinforcing agent to said substrate while heating it to a prescribed temperature, a step of carrying out additional heating in the state that the adhesion reinforcing agent is stopped from being fed to said substrate, a stop of cooling said substrate to a room temperature, and a step of coating the surface of said substrate with the photo-resist.
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