Sensor devices with internal packaged coolers
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 15, 1990
Grant Date -
N/A
app pub date -
Aug 1, 1986
filing date -
Aug 1, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Heat sensitive sensors, such as charge coupled devices which must be cooled to reduce dark current leakage, are packaged in a chip carrier and in contact with the cold surface of an electrothermal cooler the warm opposite surface of which contacts the floor of the carrier to heat the carrier body and the window of the chip carrier to prevent fogging of the cover glass while the sensor remains cold.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully