Method for manufacturing a modular semiconductor power device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 22, 1990
Issued Date -
N/A
app pub date -
Jun 27, 1989
filing date -
Mar 9, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The components used in the method comprise a heat-dissipating base plate, one or more three-layer plates (the top layer consisting of copper plates and strips) and a one-piece frame designed to constitute the terminals. After the chips have been soldered onto the upper plates and connected to the strips, the inner ends of the frame are soldered to points of connection with the chips. This is followed by the encapsulation in resin and the shearing of the outer portions of the frame, which, during the process, serve to temporarily connect the terminals.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully