Method and clamping device for bonding thin lens wafers
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United States of America Patent
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May 22, 1990
Grant Date -
N/A
app pub date -
Feb 27, 1989
filing date -
Feb 27, 1989
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A clamping device for bonding lens wafers, the device having a resilient stamp and an oppositely-disposed resilient mold. The stamp surface is slightly more curved than the concave surface of the top wafer and the mold surface is slightly more planar than the convex surface of the bottom wafer. As the wafers are squeezed between the stamp and mold, the stamp and mold deform and bonding material is squeezed evenly outwardly between the wafers.
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