Circuit module with direct liquid cooling by a coolant flowing between a heat producing component and the face of a piston

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United States of America Patent

PATENT NO 4928207
SERIAL NO

07366945

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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In an improved circuit module with a flat chip-carrying substrate and cylindrical pistons that contact the chips for cooling, each piston has an axial bore that carries a dielectric liquid to the chip and the lower face of the piston (facing the chip) is spaced away from the chip to establish radial channels that carry the liquid across the surface of the chip. The face of the piston, as seen in a section through the axis, is shaped to provide a selected flow pattern across the surface of the chip. The piston face reduces the channel height in the direction of flow where the liquid is non-boiling and thereby offsets the tendency for the flow rate to decrease as the circumferential width of the channel widens. The piston face increases the channel height in the direction of flow where the liquid is boiling to handle the increase in volume caused by the vapor. In one embodiment, the piston carries a shroud around the chip which causes the coolant to flow across the edge of the chip to provide additional chip cooling and to impinge on the nearby region of the substrate that supports the chips to remove heat that flows from the chip to the substrate.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chrysler, Gregory Poughkeepsie, NY 3 91
Chu, Richard C Poughkeepsie, NY 302 15431
Simons, Robert E Poughkeepsie, NY 312 15032

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