Method of diffusion bonding copper and titanium alloys to produce a projectile

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United States of America Patent

PATENT NO 4928368
SERIAL NO

07320242

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Abstract

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A method of diffusion bonding copper to titanium alloy employing hot isosic pressure by an inert gas in a sealed chamber. Use of niobium metal as an interfoil between the copper and titanium alloy and the application of the method to the manufacture of a projectile is also disclosed.

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Patent OwnerAddress
UNITED STATES OF AMERICA THE AS REPRESENTED BY THE SECRETARY OF THE ARMYWASHINGTON DC

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Greenspan, Jacob Newton, MA 2 29
Sacco, Gasper J Succasunna, NJ 2 13

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