Low toxicity alloy compositions for joining and sealing
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United States of America Patent
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-
May 29, 1990
Grant Date -
N/A
app pub date -
Mar 31, 1989
filing date -
Mar 31, 1988
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A lead-free alloy for joining and sealing which is useful as a plumbing solder comprises from 0.08 to 20% by weight of bismuth, from 0.02 to 1.5% by weight of copper, from 0.01 to 1.5% by weight of silver, from 0 to 0.10 percent by weight of phosphorus, from 0 to 0.20% of a rare earth mixture and the balance tin, together with incidental impurities. The alloy has a similar pasty range (i.e. melting temperature and melting range) to the traditional tin-lead plumbing solders.
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