Wafer prober
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 29, 1990
Grant Date -
N/A
app pub date -
Oct 4, 1988
filing date -
Oct 6, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A wafer prober usable with a probe card for examination of chips formed on a wafer is disclosed. The wafer prober has a function for automatically aligning bonding pads of each chip with probe needles of the probe card. The prober includes a contact plate movable in X and Y directions with a wafer chuck. The contact blade is pressed against at least one of the tips of the probe needles, and the thus contacted needle tip is observed by a TV camera from the underneath of the contact plate. The video signal obtained thereby is used for the alignment between the bonding pads and the probe needles. Also, the TV camera is moved in the X and Y directions with the wafer chuck to allow that one and the same reference mark is observed by this TV camera and by another TV camera provided for image-taking the bonding pads. With the proposed structure, the bonding pads and the probe needles can be aligned automatically and accurately.
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