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Abstract

A laser system operable in both a lead bonding mode and a lead severing mode. When in the lead bonding mode, the light-amplifying medium (38) of the laser is optically pumped by a lamp (45) to produce laser pulses within the laser cavity (36). The power supply (56) is rapidly switched to provide the bonding pulses (L.sub.b) at a high repetition rate. A Q-switch (46) is disposed within the cavity (36) to shape the laser output pulses (L.sub.b) with a leading power spike (S.sub.b) that is suitable for reducing the reflectivity of the lead (20) surface, thereby facilitating maximum absorption of the laser energy for the bonding operation. When in the severing mode, the light-amplifying medium (38) is continuously pumped and the Q-switch (46) is repetitively switched at a rate high enough to generate laser pulses (L.sub.s) suitable for severing the leads (20) without heating adjacent portions of the leads (20).

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First Claim