High thermal conductivity/low alpha emission molding compound containing high purity semiconductor filler and integrated circuit package
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United States of America Patent
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Jun 5, 1990
Issued Date -
N/A
app pub date -
Apr 12, 1988
filing date -
Jun 13, 1986
priority date (Note) -
Expired
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Abstract
The invention discloses an improved integrated circuit package having enhanced thermal conductivity comprising a molding or encapsulation resin having a semiconductor filler material. In a preferred embodiment, the semiconductor filler material comprises a high purity doped semiconductor to reduce alpha errors caused by alpha emisison normally caused by the use of fillers containing trace amounts of radioactive impurities and to provide enhanced thermal conductivity.
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