IC card and method of manufacturing the same
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United States of America Patent
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-
Jun 5, 1990
Issued Date -
N/A
app pub date -
Sep 6, 1989
filing date -
May 20, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An IC card comprises a thermoplastic resin core sheet and an IC chip bearing a conductive projection formed on an electrode of the IC chip, the IC chip being embedded in the core sheet in such a manner that the exposed top surface of the conductive projection is made flush with the main surface of the core sheet. A conductive layer pattern formed on the main surface of the core sheet is extended for contact with the exposed top surface.
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