Ultra-high density electrical interconnect system
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United States of America Patent
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-
Jun 12, 1990
Grant Date -
N/A
app pub date -
Mar 21, 1989
filing date -
Mar 21, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An ultra-high density electrical interconnect system is described wherein the pins and sockets are generally triangular in cross-section. This configuration allows for a density of 400 or more contacts per square inch wherein the contacts are supported on a grid pattern having 50 mil or less spacing between intersections. Further, the substrate supporting the contacts need be no wider than 50 mil per row of contacts. Still further, at least three rows and columns of contacts may be provided with the 50 mil or less spacing.
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