Photoflash array quick-cure laminating process
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United States of America Patent
Stats
-
Jun 19, 1990
Grant Date -
N/A
app pub date -
Sep 3, 1981
filing date -
Sep 3, 1981
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A quick-cure laminating process for multi-lamp photoflash arrays includes the application of a curable adhesive to a metallic printed circuit, the positioning of the adhesive-covered printed circuit adjacent a deformable rubber material and a circuit board and the printed circuit and circuit board intermediate a pair of surfaces movable with respect to one another and the moving of said surfaces to exert a compressive force on said printed circuit and circuit board while being heated to a temperature and for a time sufficient to effect attachment of the printed circuit to the circuit board. In another aspect, the circuit board may be of a deformable material, placed in contact with an adhesive-covered printed circuit, compressed and heated to effect attachment of the printed circuit to the circuit board.
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