Molded resin casing of electronic part incorporating flexible board
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United States of America Patent
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-
Jun 19, 1990
Grant Date -
N/A
app pub date -
Aug 22, 1988
filing date -
Aug 21, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A molded resin casing of a rotary- or sliding-type electronic part internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part, wherein a flexible board having the electric conductor patterns formed on a film comprising a synthetic resin material is used as the board, and the flexible board is inserted inside the synthetic resin casing in such as manner that the electric conductor patterns are exposed to the interior of the casing.
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