Process for preparing polymeric materials for application to printed circuits
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United States of America Patent
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-
Jun 26, 1990
Issued Date -
N/A
app pub date -
Mar 2, 1989
filing date -
Jan 11, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A process for preparing curable, aqueous strippable, polymeric materials for application, in succession, as masks, to a specific area of each of a plurality of printed circuit boards that is to be protected from the stripping and plating processes associated with gold finger plating, during the fabrication thereof, includes forming a coating of substantially identical, uniformly spaced, areas of polymeric material on a continuous length of carrier web, applying a cover coating over the carrier web and the uniformly spaced areas of polymeric material with the cover coating having a width substantially the same as that of the carrier film, and winding up in a roll the continuous length of carrier web and the cover coating with the uniformly spaced polymeric material sandwiched therebetween.
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