Flux composition
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United States of America Patent
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-
Jul 10, 1990
Grant Date -
N/A
app pub date -
Aug 14, 1989
filing date -
Aug 14, 1989
priority date (Note) -
Expired
status (Latency Note)
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Abstract
In order to avoid the undesirable formation of flux residues when soldering electronic components, as in the production of printed circuit assemblies, there is used, as the solvent for a non-corrosive flux material, a mixture composed of a major proportion by weight of a monohydric alcohol and a minor proportion by weight of a water-immiscible polyalkylene glycol dialkyl or diaryl ether.
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