Apparatus and method for forming die sites in a high density electrical interconnecting structure
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United States of America Patent
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Jul 10, 1990
Grant Date -
N/A
app pub date -
Jun 26, 1989
filing date -
Jun 26, 1989
priority date (Note) -
Expired
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Abstract
The present invention is directed to a system for removing material from a structure. The system includes an excimer laser for removing material by ablative photodecomposition and means for increasing the energy density of the laser beam. The system further includes an aperture structure having a plurality of openings of different sizes and shapes. At least one of these openings may be selectively positioned in the laser beam. Additionally, the system includes a stage for supporting the structure wherein the stage is moveable in at least the x and y directions.
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