Hermetically tight glass-metal housing for semiconductor components and method for producing same
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United States of America Patent
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-
Jul 10, 1990
Issued Date -
N/A
app pub date -
Sep 20, 1988
filing date -
Sep 23, 1987
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A hermetically tight glass-metal housing for semiconductor components and a method for producing the housing includes a base support for a semiconductor component in the form of a conducting strip having an upper portion and being suitable for functioning as a lead frame. A mounting pedestal is disposed at the upper portion of the conducting strip. Electrical contacts are disposed at the upper portion of the conducting strip for electrical connections with the semiconductor component. A metal ring is hermetically tightly sealed to the upper portion of the conducting strip. A metal cap surrounds the semiconductor component and the metal ring forms a connecting element for a tight weld with the metal cap.
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