Semiconductor integrated circuit device
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United States of America Patent
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-
Jul 10, 1990
Grant Date -
N/A
app pub date -
Mar 24, 1989
filing date -
Dec 27, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor integrated circuit device of a multi-layer type having a plurality of semiconductor chips. The device comprises a plurality of semiconductor chips each having a plurality of electrode pads, a plurality of wiring films which are arranged in correspondence with the semiconductor chips and on which the corresponding semiconductor chips are mounted, a plurality of first terminals provided in each of the wiring films and respectively connected to the plurality of electrode pads of the semiconductor chip corresponding to the wiring film, and a plurality of second terminals disposed beyond the first terminals of each wiring film and electrically connected to the respective first terminals.
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