Method for precision multichip assembly
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United States of America Patent
Stats
-
Jul 17, 1990
Grant Date -
N/A
app pub date -
Nov 15, 1989
filing date -
Nov 15, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A plurality of semiconductor chips are first attached to a transparent mask by placing indica marks on the mask and then viewing the chips through the mask and aligning them to the indica marks. The chips, which are held on a vacuum pedestal, are then brought into contact with the mask and a temporary adhesive layer holds the chips to the mask. The vacuum is then released. The mask with the chips attached thereto is then aligned to a printed circuit (wiring) board having indica marks thereon by viewing through the mask and moving the chips and printed circuit board together until they contact each other. A permanent adhesive layer holds the chips to the printed circuit board. The temporary adhesive layer is then dissolved and removed from the chips.
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