Metallization of substrates
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United States of America Patent
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-
Jul 24, 1990
Grant Date -
N/A
app pub date -
Sep 11, 1984
filing date -
Sep 12, 1985
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of metallizing a substrate by applying a metallic film to the substrate and measuring the film at a plurality of different lateral positions of the substrate by inducing an eddy current in the film and detecting the magnitude of the film to provide an indication of film thickness.
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