High sensitivity mid and deep UV resist
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United States of America Patent
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Jul 24, 1990
Issued Date -
N/A
app pub date -
Jul 6, 1989
filing date -
Aug 5, 1988
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Positive photoresist compositions are provided which contain (a) a mixture of mono-, di-, and triesters of 2,3,4-trihydroxybenzophenone and 1,2-naphthoquinone-2-diazo-4-sulfonic acid and (b) a novolak resin selected from resins prepared from a phenolic component having a high p-cresol content or from a mixture of formaldehyde and an aromatic aldehyde.
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