Process for the manufacture of multi-layer circuits with dynamic flexing regions and the flexible circuits made therefrom
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 31, 1990
Grant Date -
N/A
app pub date -
May 6, 1988
filing date -
May 6, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A multilayer through-hole contacted flexible circuit and method of manufacture thereof is presented having a laminar construction which is strictly symmetrical in the bending area; and which has no exposed adhesive. The method comprises the formation of a diclad laminate comprised of an adhesiveless flex circuit (e.g. conductive foil directly on non-conductive flexible carrier film) which is adhered to a second conductive layer using a suitable adhesive. Next, through-holes are formed in the laminate followed by electroless deposition of metal on the through-hole sidewalls. The laminate then undergoes conventional etching processing using photo resist followed by lamination thereof to an adhesive coated polymeric cover film over exposed conductive areas so as to define a dynamic flex region in the area between the through-holes.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully