Printed circuit with thermal drain
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 31, 1990
Grant Date -
N/A
app pub date -
Sep 16, 1988
filing date -
Mar 6, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The invention discloses a printed circuit card on which is welded at least an electronic component box as well as a thermal dissipator for dissipating the heat emitted by the component box. The component box and the thermal dissipator are respectively provided with clips and lugs which are engaged and welded in respective holes drilled in the card. A thermal drainage metallic area provided on a zone of the card located under the box forms a thermal adduction path between the box and the lugs of the thermal dissipator. This thermal drainage metallic area is further connected to a clip ensuring a privileged thermal drainage of the electronic component box.
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