Method for providing a design pattern on a metal stencil and metal stencil having a patternable covering layer
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United States of America Patent
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Aug 7, 1990
Grant Date -
N/A
app pub date -
May 13, 1988
filing date -
May 15, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention relates to a method for forming a pattern in a metal stencil or screen which is covered by a covering layer in the form of a resist material. The pattern is formed by locally removing the lacquer or resist from the screen's perforations with the use of a beam of high energy radiation such as a laser beam. The resist material used is filled to a high concentration with metal powder to increase its thermal conductivity. The present invention also relates to a metal stencil provided with such a metal-filled covering layer which is patternable with the use of a radiation beam.
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