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Abstract

A method for insertion of active components in chip cards. A card is made with a cavity, whose edges are formed from a material having shape memorization properties. The initial shape of the cavity at ordinary temperature is that of a basin having dimensions for housing an integrated circuit micromodule, with overhanging edges which do not allow the micromodule to go out of the cavity or to be inserted into the cavity. The card is then plastically deformed with the overhanging edges pushed back a sufficient distance and the integrated circuit micromodule is inserted. Finally, the card is heated to a temperature at which its shape memorization effect is displayed, and the plastically deformed edges of the cavity again become elastic and resume their initial overhanging shape.

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First Claim