Semiconductor devices and method of manufacturing the same
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United States of America Patent
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Aug 14, 1990
Issued Date -
N/A
app pub date -
Jan 11, 1989
filing date -
Sep 12, 1985
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The semiconductor devices include a semiconductor substrate, a first CCD region formed at the surface of said substrate, and a second CCD region having a side connected to said first CCD. A channel region of the first CCD region has a different channel potential at a latter part of the end transfer electrode corresponding to the portion of the first CCD region connected to the second CCD region.
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