Importance

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Abstract

Removal of dissolved copper from solution according to the present invention involves treatment of waste solutions such as electroless copper overflow solutions with aluminum particles under reaction conditions promoting precipitation of dissolved copper from solution as metallic copper. Copper plating solutions having high concentrations of dissolved copper are inactivated in overflow reservoir (12) by addition of an inactivating agent from reservoir (14) to prevent plating of metallic copper onto vessels and conduits during collection, storage and/or transport of the solution. Inactivation of the copper plating solution is followed by precipitation of dissolved copper from solution as metallic copper in reaction vessel (20) by addition of aluminum particles from reservoir (24). Reducing agent and caustic agent may also be added to the reaction vessel from reservoirs (22) and (26), respectively, to yield a purified solution which is substantially free of dissolved copper and suitable for discharge after pH adjustment.

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First Claim